发明名称 流動特性測定用金型、流動特性測定方法、半導体封止用樹脂組成物及び半導体装置の製造方法
摘要 According to the invention, a mold for measuring flow characteristics which is used to measure the flow characteristics of a resin composition, which is a measurement subject, by injecting the resin composition into a flow path provided in the mold, in which the minimum distance from the cross-sectional center of gravity to the outline in the cross-sectional shape of the flow path is equal to or more than 0.02 mm and equal to or less than 0.4 mm, and a method for measuring flow characteristics in which a resin composition, which is a measurement subject, is injected into the flow path of the mold for measuring flow characteristics, and made to flow in a single direction, and the flow distance from the start point to the end point of the flow of the resin composition is obtained as the flow length are provided.
申请公布号 JP5742723(B2) 申请公布日期 2015.07.01
申请号 JP20110543097 申请日期 2010.11.17
申请人 住友ベークライト株式会社 发明人 西川 敦准
分类号 G01N11/00 主分类号 G01N11/00
代理机构 代理人
主权项
地址