布线图案之制造方法及电晶体之制造方法;WIRING PATTERN MANUFACTURING METHOD AND TRANSISTOR MANUFACTURING METHOD

摘要

本发明之布线图案之制造方法具有如下步骤：于基板(2)上涂布含有第1形成材料之液状体而形成基底膜(3)；于基底膜(3)之表面至少一部分涂布含有第2形成材料之液状体而形成基底膜(3)之保护层(9)；于保护层(9)之表面形成抗蚀层(4A)并利用所欲之图案光对抗蚀层(4A)进行曝光；使经曝光之抗蚀层(4A)与显影液(D)接触，去除抗蚀层(4A)及保护层(9)直至基底膜(3)与图案光对应而露出为止；及于在露出之基底膜(3)之表面使触媒(5)析出后，使无电解镀敷液接触基底膜(3)之表面而进行无电解镀敷。; applying a liquid body including a second formation material on at least part of the surface of the base film (3) to form a protection layer (9) of the base film (3); forming a resist layer (4A) on the surface of the protection layer (9) and exposing the resist layer (4A) with desired patterned light; making the exposed resist layer (4A) to contact with a developer (D) to remove the resist layer (4A) and the protection layer (9) until the base film (3) is uncovered corresponding to the patterned light; and after precipitating a catalyst (5) on the surface of the uncovered base film (3), making an electroless plating solution to contact with the surface of the base film (3) to perform electroless plating.