聚矽氧烷;POLYSILOXANE

摘要

一种硬化性组成物，其系含有：具有烯基及密接性基团的聚矽氧烷(A)、每1分子中至少具有两个与矽原子结合之氢原子的聚矽氧烷(B)(但聚矽氧烷(A)除外)、及矽氢化反应用催化剂(C)。其特征为，以该硬化性组成物中所含之全部成分的含量的合计为100质量%时，聚矽氧烷(A)的含有比例为40~90质量%。;本发明的硬化性组成物，系可形成兼顾对基板或金属配线等的高黏着性和LED等之初期亮度高的硬化物之氢矽烷系聚矽氧烷组成物。因此，用由该硬化性组成物所获得的硬化物覆盖半导体发光元件而获得的光半导体装置，其初期亮度高，且即使在受到热循环的情况下，硬化物也不会从封装剥落等，硬化物的黏着性高。;The curable composition of the present invention is capable of forming a hydrosilyl series polysiloxane composition which is having both high adhesiveness for substrates or metal lines, and high Initial luminance of LED etc. Therefore, an optical semiconductor device which is obtained by covering the semiconductor light-emitting element by the cured article obtained from the curable composition, the initial luminance is high, even in the case of undergoing heat cycle, the cured article is having high adhesiveness and could not separate of package and the like.