| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a compact wiring board having high bond strength between a terminal electrode and an insulation substrate. <P>SOLUTION: The wiring board includes: an insulation substrate 1; a terminal electrode 2 disposed on the top face of the insulation substrate 1; and a lead terminal 5 bonded to the terminal electrode 2 and extending to the face direction of the insulation substrate 1. The wiring board further includes a metallic body 2a protruding from the terminal electrode 2 into the insulation substrate 1. The metallic body 2a is disposed at least on an end portion of the terminal electrode 2 on the opposite side to the extending direction of the lead terminal 5. Even if tensile force is applied to the terminal electrode 2 by the application of stress to pull the lead terminal 5 to the face direction of the insulation substrate 1, the metallic body 2a is engaged inside the insulation substrate 1, and thus, the terminal electrode 2 can be prevented from being peeled from the insulation substrate 1. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
