发明名称 |
INJECTION-MOLDING APPARATUS |
摘要 |
<p>Disclosed are injection moldings, an injection-molding apparatus and a method thereof. The injection-molding apparatus comprises: a cavity mold having a cavity; a core mold having a core surface to form a molding space for injection moldings when being joined to the cavity mold; a heating unit for heating the cavity mold or the core mold; a cooling unit for cooling the cavity mold or the core mold; and a patterning stamp having a micrometer or nanometer sized pattern and provided on an inner surface of the molding space. According to the injection-molding apparatus, a micrometer or nanometer sized pattern is formed on a surface of injection moldings so as to have a super-hydrophobic characteristic and an optical characteristic, and a micrometer or nanometer sized pattern of a complex structure can be implemented.</p> |
申请公布号 |
EP2193015(B1) |
申请公布日期 |
2015.07.01 |
申请号 |
EP20070793732 |
申请日期 |
2007.08.28 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
JUN, HYUN-WOO;KIM, YOUNG-BAE;JUNG, CHANG-IL;JEONG, SEOK-JAE;YOON, HYUNG-PYO |
分类号 |
B29C45/37;B29C33/02;B29C33/42;B29C45/73 |
主分类号 |
B29C45/37 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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