| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing composition which is arranged so that flaw and corrosion are less prone to being caused on the surface of a wiring metal, and a wiring metal residue is less prone to being left on an interlayer dielectric film and a barrier layer, an adequate polishing speed can be ensured, and high flatness can be achieved by preventing the dishing and erosion. <P>SOLUTION: The polishing composition for polishing a copper or copper alloy material comprises: (A) an oxidant; (B) at least one acid selected from the group consisting of an amino acid, a carboxylic acid with up to 8 carbon atoms and an inorganic acid; (C) a sulfonic acid having an alkyl group with 8 or more carbon atoms; (D) a fatty acid having an alkyl group with 8 or more carbon atoms; and (E) 0.005-3 mass% of N-vinyl imidazole. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
