Microelectronic substrate having a buried layer of organic material

摘要

The substrate (100) has a support layer (102) and a top layer (106), where the top layer comprises a semiconductor. A layer (104) is made of organic material i.e. photosensitive resin, able to be etched selectively with respect to the semiconductor of the top layer by using a dry etching, and arranged between the support layer and the top layer. A getter material layer is arranged between the support layer and the layer of organic material. A dielectric material portion in the layer of organic material forms a closed contour. Independent claims are also included for the following: (1) a method for producing a microelectronic substrate (2) a method for producing a microelectronic device.