| 摘要 |
<p>The present invention relates to a printed circuit board and an electronic element assembly comprising the same which can prevent discoloration of a metal used to increase reflectivity of a light emitted from an electronic element, by including: a base part; a plurality of wire layers which is formed as being arranged on the base part separately with each other; a plating layer which is formed on the wire layer in a Ni/Ag stacking structure, and is classified into a first area reflecting the light emitted from the electronic element chip and a second area formed on an area which is not overlapped with the first area; one of a printed circuit board which is manufactured by a transparent coating layer formed on the first area and a metal protection layer formed on the second area or a printed circuit board which is formed on the first area and the second area and includes a metal protection layer formed more thinly than an Ag layer of the plating layer; at least one electronic element chip which is mounted on the center area of the printed circuit board; and a wire whose one end is connected to the printed circuit board and another end is connected to the electronic element chip directly.</p> |
