| 摘要 |
PROVIDED IS A HIGH-TEMPERATURE LEAD-FREE SOLDER ALLOY HAVING EXCELLENT TENSILE STRENGTH AND ELONGATION IN A HIGH-TEMPERATURE ENVIRONMENT OF 250°C. IN ORDER TO MAKE THE STRUCTURE OF AN SN-SB-AG-CU SOLDER ALLOY FINER AND CAUSE STRESS APPLIED TO THE SOLDER ALLOY TO DISPERSE, AT LEAST ONE MATERIAL SELECTED FROM THE GROUP CONSISTING OF, IN MASS%, 0.003 TO 1.0% OF A1, 0.01 TO 0.2% OF FE, AND 0.005 TO 0.4% OF TI IS ADDED TO A SOLDER ALLOY CONTAINING 35 TO 40% OF SB, 8 TO 25% OF AG, AND 5 TO 10% OF CU, WITH THE REMAINDER MADE UP BY SN. |
