发光晶片封装体及其形成方法,申请号TW099116267-传众专利搜索

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发明名称	发光晶片封装体及其形成方法
摘要
申请公布号	TWI491065	申请公布日期	2015.07.01
申请号	TW099116267	申请日期	2010.05.21
申请人	精材科技股份有限公司	发明人	吴上义;刘沧宇
分类号	H01L33/00;H01L23/24	主分类号	H01L33/00
代理机构		代理人	洪澄文台北市南港区三重路19之6号2楼;颜锦顺台北市南港区三重路19之6号2楼
主权项	一种发光晶片封装体，包括：一承载基底，具有一第一表面及相反之一第二表面，以及自该第一表面朝该第二表面延伸之凹槽；至少一导电通道及至少一导热插塞，位于该凹槽外侧且穿过该承载基底之第一表面及第二表面；以及一发光元件，具有至少一接点电极，设置在该凹槽内，其中该接点电极电性连接该导电通道且与该导热插塞绝缘，该接点电极面向该凹槽的一底部。
地址	桃园市中坜区中坜工业区吉林路23号9楼

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