| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To efficiently hold an image sensor with an electric element disposed on its outer periphery. <P>SOLUTION: A solid-state imaging device comprises: an image sensor such as a CCD or a CMOS; a holding member disposed on the outer periphery of the image sensor; and an electric element disposed between the image sensor and the holding member on at least one side of the image sensor. They are adhesively fixed between the image sensor and the holding member on a side on which the electric element is not disposed. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
