| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film for forming a protective film capable of being manufactured by a semiconductor device, the film having high uniformity and high reliability even when exposed under sever temperature condition. <P>SOLUTION: The film for forming the protective film contains a binder polymer component (A), a curable component (B) a coloring agent (C) and a porous silica (D), wherein the content of the porous silica (D) is 1-80 pts.wt, per 100 pts.wt. total solid portion. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
