| 摘要 |
A semiconductor device which can be miniaturized is provided. The semiconductor device includes a frame body (3) having an opening region (2) formed in a central portion, an insulating substrate (4) which is provided in the opening region of the frame body and on which semiconductor chips (8) and (9) are mounted, lead portions (5a) to (5e), each including an inclined portion that is at least partially exposed to the opening region formed in the frame body and extends so as to be inclined with respect to an end surface forming the opening region, and a bonding wire (10) that is bonded between the lead portion and the semiconductor chip by ultrasonic bonding. |
