REDUCING ELECTROLESS SILVER PLATING SOLUTION AND REDUCING ELECTROLESS SILVER PLATING METHOD

摘要

Provided are a reducing electroless silver plating solution and a reducing electroless silver plating method using the silver plating solution, the reducing electroless silver plating solution being capable of preventing decomposition of silver in the plating solution thereby to maintain stability of the solution and also being capable of preventing excessive roughening of an underlying metal or the like thereby to form a plating film having good film characteristics and a good appearance. The reducing electroless silver plating solution according to the present invention comprises a water-soluble silver salt and a reducing agent, wherein cyanide ions in a concentration of 0.006 × 10 -3 mol/L to 12.5 × 10 -3 mol/L are contained.