Electrical connectivity of die to a host substrate

摘要

According to example configurations herein, an apparatus comprises a die and a host substrate. The die can include a first transistor and a second transistor. A surface of the die includes multiple conductive elements disposed thereon. The multiple conductive elements on the surface are electrically coupled to respective nodes of the first transistor and the second transistor. Prior to assembly, the first transistor and second transistor are electrically isolated from each other. During assembly, the surface of the die including the respective conductive elements is mounted on a facing of the host substrate. Accordingly, a die including multiple independent transistors can be flipped and mounted to a respective host substrate such as printed circuit board, lead frame, etc.

主权项

1. An apparatus comprising:
a die comprising:
a first transistor,a second transistor, anda surface including multiple conductive elements thereon, the multiple conductive elements on the surface electrically coupled to respective nodes of the first transistor and the second transistor; a host substrate, the surface of the die mounted on a facing of the host substrate; wherein the first transistor is a control switch of a switching power supply circuit and the second transistor is a synchronous switch in the switching power supply circuit.