主权项 |
1. A method of characterizing a semiconductor device from conductive-probe measurements performed on a semiconductor wafer from which the device is manufactured, said wafer including a p-type semiconductor layer and an n-type semiconductor layer defining a p-n junction, the method comprising the following steps:
applying electrical stimuli to the wafer through a probe in direct contact with one of said semiconductor layers to produce conductive-probe measurement data; fitting a current-voltage curve (I-V) model to said conductive-probe measurement data, said model expressing a current-voltage relationship as a function of resistance; and estimating a current-voltage curve (I-Vd) for the device by removing from the (I-V) model resistance effects calculated from data generated by the fitting step; wherein the resistance is assumed variable with current and the resistance is calculated from measurement data points from the equation:R=ΔVΔIwhere R is resistance, V is voltage, and I is current;
wherein the device's forward voltage, ideality factor, resistance and reverse saturation current are calculated from the following set of equations:Ri=αIiβ+CI(i)=I0exp(q(Vi-IiRi)nkT)Vd(i)=IiRi+kTqnln(IiI0+1)where Vd is the device's forward voltage, I0 is reverse saturation current, n is ideality factor, and α, β, and C are constant parameters estimated by fitting N current-voltage measurement data points, (Ii,Vi), i=1K N, with a multi-parameter minimization calculation; and
wherein said multi-parameter minimization calculation is carried out with the following estimator:Σ(α,β,C,n,I0)=∑i=1N[wi(Ii-IMi)2+1wi(Vi-VMi)2]where Mi refers to said measurement data points, and wi is an empirical weight factor that accounts for the increased sensitivity of the current-voltage curve for the device to current at high current values and to voltage at low current values. |