Semiconductor device manufacturing method and semiconductor device

摘要

In a method of manufacturing a semiconductor device, a molding die for molding a resin case for a semiconductor device is prepared such that the molding die has protrusions to fix each of a plurality of terminals having a leg portion in a predetermined position. Each of the plurality of terminals is held to the corresponding protrusions in the molding die, and resin is injected into the molding die to integrally mold the plurality of terminals and the resin case.

主权项

1. A semiconductor device, comprising:
an insulating circuit substrate mounted with at least one semiconductor element; a resin case provided with a plurality of terminals having leg portions; and protrusion marks formed in vicinities of the leg portions of the plurality of terminals of the resin case, wherein the plurality of terminals and the resin case are integrally molded using a molding die, and the protrusion marks are marks where protrusions for fixing the plurality of terminals in predetermined positions in the molding die are placed.