Structure for interconnecting copper with low dielectric constant medium and the integration method thereof

摘要

The present invention belongs to the technical field of semiconductor devices, and discloses a structure for interconnecting a medium of low dielectric constant with copper and the integration method thereof. It includes: using a combination of copper interconnections and air gaps to reduce capacity, and a special structure to support copper conductors so as to maintain the shape of copper conductors after removing the medium. The advantage of the present invention is that it can realize the complete air gap structure without short circuit or disconnection of copper conductors as well as the complete air gap structure with long conductors, thus reducing RC delay.

主权项

1. A structure for copper interconnection with a medium of low dielectric constant includes at least one metal conductor and a plurality of insulator supporting structures under each of the metal conductors, the said insulator supporting structures are used for supporting the respective metal conductors,
wherein holes are configured between the metal conductors and also between the insulator supporting structures which are located under the same metal conductor and are used for supporting it.