| 发明名称 |
Wettable lead ends on a flat-pack no-lead microelectronic package |
| 摘要 |
Methods of manufacturing a flat-pack no-lead microelectronic package (2100) coat exposed base metal at a cut end of a lead frame of the package with solder (1001). One method coats the exposed base metal with solder when the package is in a strip (200, 300). Another method coats the exposed base metal with solder after the package is singulated. As a result, all portions of leads of the package that may receive solder during mounting of the package to a printed circuit board are solder wettable. A solder wettable lead end (504) on the package facilitates formation of a solder fillet during mounting of the package. |
| 申请公布号 |
US9070669(B2) |
申请公布日期 |
2015.06.30 |
| 申请号 |
US201213673212 |
申请日期 |
2012.11.09 |
| 申请人 |
Freescale Semiconductor, Inc. |
发明人 |
Daniels Dwight L.;Magnus Alan J.;O'Brien Pamela A. |
| 分类号 |
H01L21/48;H01L23/495;H01L23/00 |
主分类号 |
H01L21/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a microelectronic package, comprising:
providing a lead frame strip that includes a plurality of lead frames, the lead frame strip having saw lanes between the lead frames; encapsulating the lead frame strip; after encapsulating, removing metal of the lead frame strip along the saw lanes; after removing metal, applying solder to the lead frame strip; reflowing the solder; and singulating the lead frame strip into individual microelectronic packages after the reflowing. |
| 地址 |
Austin TX US |
