Chip-scale packaging with protective heat spreader

摘要

A semiconductor package can include a semiconductor die having an integrated circuit, a first die surface, and an opposite second die surface. A packaging can be attached to the die and have a holder surface opposite the first die surface. A heat spreader can be configured to cover the second die surface and the packaging surface and can be attached thereto by a layer of adhesive positioned between the heat spreader and the semiconductor die. A semiconductor package array can include an array of semiconductor dies and a heat spreader configured to cover each semiconductor die. A conductive lead can be electrically connected to the integrated circuit in a semiconductor die and can extend from the first die surface. Manufacturing a semiconductor package can include applying thermally conductive adhesive to the heat spreader and placing the heat spreader proximate the semiconductor die.

主权项

1. A chip-scale semiconductor package for placing on a printed circuit board, comprising:
a semiconductor die having a die top surface and a die bottom surface; a packaging
at least partially surrounding the die andpresenting an outer surface made-ready for contacting the printed circuit board; and a plurality of conductive leads electrically coupled to the semiconductor die, each of the plurality of conductive leads
extending from the die bottom surface to the outer surface of the packagingto have at least one exposed surface for electrical connection to the printed circuit board; and a heat spreader
configured to cover the die top surface,the heat spreader being attached to the die by a layer of adhesive positioned between the heat spreader and the die, anda perimeter of the heat spreader extending beyond the semiconductor die and packaging; wherein all portions of the packaging below the heat spreader are narrower than the heat spreader.