发明名称 |
Method for improving plating on non-conductive substrates |
摘要 |
A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated. |
申请公布号 |
US9067238(B2) |
申请公布日期 |
2015.06.30 |
申请号 |
US201313741446 |
申请日期 |
2013.01.15 |
申请人 |
|
发明人 |
Hamilton Robert;Long Ernest;Krol Andrew M. |
分类号 |
B05D1/18;B05D3/00;C08J7/18;B05D3/06;C23C18/16;C23C18/20;C23C18/38;H05K3/18 |
主分类号 |
B05D1/18 |
代理机构 |
Carmody Torrance Sandak & Hennessey LLP |
代理人 |
Carmody Torrance Sandak & Hennessey LLP |
主权项 |
1. A method of treating a laser-activatable non-conductive substrate that comprises a metal compound, the method comprising the steps of:
a) treating the laser-activatable non-conductive substrate that comprises the metal compound with an aqueous composition comprising:
i) a thiol functional organic compound; andii) optionally, a surfactant; b) selectively laser activating portions of a surface of the laser-activatable non-conductive substrate; c) contacting the substrate with an electroless plating bath such that areas of the laser-activatable non-conductive substrate which were contacted by the laser plate, but areas that were not contacted by the laser do not plate. |
地址 |
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