发明名称 Method for improving plating on non-conductive substrates
摘要 A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.
申请公布号 US9067238(B2) 申请公布日期 2015.06.30
申请号 US201313741446 申请日期 2013.01.15
申请人 发明人 Hamilton Robert;Long Ernest;Krol Andrew M.
分类号 B05D1/18;B05D3/00;C08J7/18;B05D3/06;C23C18/16;C23C18/20;C23C18/38;H05K3/18 主分类号 B05D1/18
代理机构 Carmody Torrance Sandak & Hennessey LLP 代理人 Carmody Torrance Sandak & Hennessey LLP
主权项 1. A method of treating a laser-activatable non-conductive substrate that comprises a metal compound, the method comprising the steps of: a) treating the laser-activatable non-conductive substrate that comprises the metal compound with an aqueous composition comprising: i) a thiol functional organic compound; andii) optionally, a surfactant; b) selectively laser activating portions of a surface of the laser-activatable non-conductive substrate; c) contacting the substrate with an electroless plating bath such that areas of the laser-activatable non-conductive substrate which were contacted by the laser plate, but areas that were not contacted by the laser do not plate.
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