High power light emitting diode package

摘要

The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

主权项

1. A high power Light Emitting Diode (LED) package id="REI-00002" date="20150630" mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED packageid="REI-00002" id="REI-00003" date="20150630" , id="REI-00003" comprising:
an LED chip; a package body integrally formed with resin to have a recess for receiving the LED chip; a first sheet metal member electrically connected with the LED chip whilehaving an upper partial portion supporting the LED chip at its upper partial portion in the recess, the first sheet metal member being surrounded by the package body and extending to thea side face of the package body to be exposed to an outside of the package body, the first sheet metal member having a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from thean inside of the package body so that a lower end thereofof the section is exposed at a bottom face of the package body thus to contact the board, such that the first sheet metal member is formed as a single body; a second sheet metal member electrically connected with the LED chip and spaced apart from the first sheet metal member forby a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member; and a transparent sealant sealingly filled up intoin the recess; wherein the second sheet metal member is divided into a pair of first and second terminals insulated from each other, and the first terminal and the second terminal are connected with electrodes of the LED chip, respectively.