发明名称 Omnidirectional camera
摘要 An omnidirectional camera comprises a camera mounting frame 5 of a cylindrical hollow body, two or more first mount blocks 8 which hold a first lens unit 9 in a horizontal posture and are installed to the camera mounting frame from a horizontal direction, and first circuit boards provided on inner end surfaces of the first mount blocks, and in the omnidirectional camera, the camera mounting frame and the first mount blocks are made of materials with good heat transfer properties, the first circuit board has a ground layer formed on an abutting surface with respect to the first mount block and a first image pickup element arranged on an optical axis of the first lens unit, and the heat generated from the first image pickup element is radiated from the first mount block and the camera mounting frame through the ground layer.
申请公布号 US9071767(B2) 申请公布日期 2015.06.30
申请号 US201213426659 申请日期 2012.03.22
申请人 Kabushiki Kaisha TOPCON 发明人 Sasagawa Jun;Yamada Hirokazu
分类号 H04N5/225;H04N7/00;H01H47/00;H05K5/00;H05K9/00;H04N5/247;G03B11/04;H04N7/18;G03B17/00;H04N5/232 主分类号 H04N5/225
代理机构 Nields, Lemack & Frame, LLC 代理人 Nields, Lemack & Frame, LLC
主权项 1. An omnidirectional camera, comprising a camera mounting frame of a cylindrical hollow body, two or more first mount blocks which hold a first lens unit in a horizontal posture and are installed to said camera mounting frame from a horizontal direction, and first circuit boards provided on inner end surfaces of said first mount blocks, wherein said camera mounting frame and said first mount blocks are made of a metal material, wherein said first circuit board has a ground layer formed on a surface abutting said first mount block, such that the ground layer is in contact with the inner end surface of the first mount block, and said first circuit board has a first image pickup element disposed on said surface and arranged on an optical axis of said first lens unit, and wherein the heat generated from said first image pickup element is radiated from said first mount block and said camera mounting frame through said ground layer.
地址 Tokyo-to JP