| 发明名称 | Chip package with embedded passive component | ||
| 摘要 | A chip package includes an electrically conducting chip carrier and at least one first semiconductor chip attached to the electrically conducting chip carrier. The chip package further includes a passive component. The electrically conducting chip carrier, the at least one first semiconductor chip, and the passive component are embedded in an insulating laminate structure. | ||
| 申请公布号 | US9070568(B2) | 申请公布日期 | 2015.06.30 |
| 申请号 | US201313951556 | 申请日期 | 2013.07.26 |
| 申请人 | INFINEON TECHNOLOGIES AG | 发明人 | Hosseini Khalil;Mahler Joachim;Meyer-Berg Georg |
| 分类号 | H01L23/34;H01L25/065;H01L23/12;H01L23/00;H01L49/02 | 主分类号 | H01L23/34 |
| 代理机构 | Murphy, Bilak & Homiller, PLLC | 代理人 | Murphy, Bilak & Homiller, PLLC |
| 主权项 | 1. A chip package, comprising: an electrically conducting chip carrier; at least one first semiconductor chip attached to the electrically conducting chip carrier; a passive component; and an insulating laminate structure embedding the electrically conducting chip carrier, the at least one first semiconductor chip, and the passive component, wherein the passive component is arranged at a different level than the first semiconductor chip such that the passive component does not pass through any plane parallel to a main surface of the first semiconductor chip and intersecting the first semiconductor chip. | ||
| 地址 | Neubiberg DE | ||