发明名称 Interconnect structure for coupling an electronic unit and an optical unit, and optoelectronic module
摘要 <p>The present invention relates to an interconnect structure for coupling an electronic unit (120) for outputting and/or receiving electric signals, and an optical unit (100) for converting said electric signals into optical signals and/or vice versa. The present invention also relates to an optoelectronic module comprising such an interconnect structure. The interconnect structure comprises an electrically insulating substrate and at least one pair of transmission leads (104, 106) to be coupled between said electronic unit (120) and said optical unit (100), a first lead (104) being operable as a signal line, a second lead (106) being operable as a ground line, wherein said second lead (106) is formed to have a lower impedance than said first lead (104). Cross-talk between neighbouring VCSEL is reduced as a signal current supplied by the signal line (104a) is mainly returned via the respective ground line (106a) and not via the signal line (104b) of the adjacent VCSEL. The ground lines (106) are connected to a ground plane layer (108) via contacts (118).</p>
申请公布号 IL238853(D0) 申请公布日期 2015.06.30
申请号 IL20150238853 申请日期 2015.05.17
申请人 TYCO ELECTRONICS SVENSKA HOLDINGS AB 发明人
分类号 H01S 主分类号 H01S
代理机构 代理人
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