| 摘要 |
<p>The present invention relates to a hyperfrequency interconnection device (60) between two components (40, 50). Each component comprises upper surfaces (42, 52), and signal lines (41, 51) aligned on the upper surfaces (42, 52). Planes comprising the upper surfaces (42, 52) of the components (40, 50) are divided as much as a distance known as height difference (70). A hyperfrequency interconnection device (60) comprises: a substrate (80) including an upper surface (82) and a lower surface defined by a first shaft (X) and a second shaft (Y) perpendicular to the first shaft (X); a signal line (83) aligned on the lower surface of the substrate (80), and whose projection with respect to a plane (XY) of the upper surface (82) of the signal line (83) forms the first shaft (X); and at least two contact pads (90, 91) capable of electrically connecting the signal line (83) of the device (60) with the signal lines (41, 51) of the components (40, 50). The present invention has an effect of providing flexibility with respect to the substrate (80) along the first shaft (X) as the upper surface (82) of the substrate (80) is wrinkled along the second shaft (Y).</p> |
