发明名称 Method of lowering temperature of substrate table, computer-readable storage medium, and substrate processing system
摘要 A method of lowering a temperature of a substrate table uses a substrate W processing system including a first substrate table 2b; one or more processing chambers 1b, in each of which the first substrate table 2b is disposed, the processing chamber being configured to perform a predetermined process, with the substrate being placed on the first substrate table 2b; a substrate transfer apparatus 31 configured to transfer the substrate to the processing chamber 1b; a transfer chamber in which the substrate transfer apparatus 31 is disposed; and a second substrate table configured to cool the substrate. The method of lowering a temperature of a substrate table comprises the steps of first transfer in which the substrate W placed on the first substrate table 2b is transferred to the second substrate table by the substrate transfer apparatus 31, and second transfer in which the substrate placed on the second substrate table is transferred to the first substrate table 2b. By repeating the step of first transfer and the step of second transfer, a heat of the first substrate table 2b is absorbed by the substrate W placed on the first substrate table 2b, so that a temperature of the first substrate table 2b is lowered.
申请公布号 US9070728(B2) 申请公布日期 2015.06.30
申请号 US201012958955 申请日期 2010.12.02
申请人 TOKYO ELECTRON LIMITED 发明人 Kobayashi Kenichi;Nakayama Youichi;Kai Kozo;Shirasaka Kenji
分类号 F28F7/00;H01L21/677;C23C16/46;H01L21/67 主分类号 F28F7/00
代理机构 Smith, Gambrell & Russell LLP 代理人 Smith, Gambrell & Russell LLP
主权项 1. A method of lowering a temperature of a substrate table in a semiconductor substrate processing system including: a first substrate table provided with a heating mechanism for heating a semiconductor substrate; a processing chamber in which the first substrate table is disposed, the processing chamber being configured to perform a predetermined process with the substrate being placed on the first substrate table; a temperature sensor configured to determine a temperature of the first substrate table; a substrate transfer apparatus configured to transfer the substrate to the processing chamber; a transfer chamber in which the substrate transfer apparatus is disposed; a second substrate table configured to cool the substrate; and a controller configured to control the semiconductor substrate processing system; the method of lowering temperature of a substrate table comprising the steps of: determining a temperature of the first substrate table by use of the temperature sensor; a first transfer controlled by the controller in which the substrate placed on the first substrate table and heated by the first substrate table to a substrate temperature is transferred to and placed on the second substrate table by the substrate transfer apparatus; a second transfer controlled by the controller in which the substrate placed on the second substrate table and cooled to another substrate temperature by the second substrate table is transferred to and placed on the first substrate table by the substrate transfer apparatus; and repeating the step of first transfer, the step of second transfer, and the temperature determining step until the temperature of the first substrate table is lowered to a predetermined temperature by transferring heat from the first substrate table to the substrate.
地址 Tokyo-To JP