发明名称 Micromachined structures
摘要 A micromachined structure includes a substrate and a suspended structure. The substrate has a cavity formed thereon. The suspended structure is formed on the cavity of the substrate. The suspended structure includes a first metal layer, a second metal layer, and a first dielectric layer positioned between the first and second metal layers, wherein the first dielectric layer has a first opening in communication with the cavity through an opening formed in the first metal layer.
申请公布号 US9070699(B2) 申请公布日期 2015.06.30
申请号 US201213343187 申请日期 2012.01.04
申请人 PIXART IMAGING INC. 发明人 Wang Chuanwei;Tsai Ming Han;Sun Chih Ming;Fang Weileun
分类号 H01L21/00;H01L49/02;H01L29/84 主分类号 H01L21/00
代理机构 Lowe Hauptman & Ham, LLP 代理人 Lowe Hauptman & Ham, LLP
主权项 1. A micromachined structure, comprising: a substrate having a cavity formed thereon, wherein the substrate defines a horizontal direction parallel to a surface thereof; and a suspended structure formed on the cavity of the substrate, the suspended structure comprising a first metal layer,a second metal layer,a first dielectric layer positioned between the first and second metal layers,a second dielectric layer disposed on the second metal layer,a third metal layer disposed on the second dielectric layer, anda third dielectric layer disposed on the third metal layer, wherein the first dielectric layer has a first opening in communication with the cavity through an opening formed in the first metal layer, the second dielectric layer has a second opening in communication with the first opening through an opening formed in the second metal layer, the third dielectric layer has a third opening in communication with the second opening through an opening formed in the third metal layer, and the second opening has a second width in the horizontal direction, the third opening has a third width in the horizontal direction, and the second width is greater than the third width.
地址 Hsin-Chu TW