发明名称 Method and apparatus for forming a semiconductor gate
摘要 The present disclosure provides an apparatus and method for fabricating a semiconductor gate. The apparatus includes, a substrate having an active region and a dielectric region that forms an interface with the active region; a gate electrode located above a portion of the active region and a portion of the dielectric region; and a dielectric material disposed within the gate electrode, the dielectric material being disposed near the interface between the active region and the dielectric region. The method includes, providing a substrate having an active region and a dielectric region that forms an interface with the active region; forming a gate electrode over the substrate, the gate electrode having an opening near a region of the gate electrode that is above the interface; and filling the opening with a dielectric material.
申请公布号 US9070663(B2) 申请公布日期 2015.06.30
申请号 US201313968507 申请日期 2013.08.16
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Chu Chen-Liang;Chen Fei-Yuh;Yao Chih-Wen
分类号 H01L21/3205;H01L29/423;H01L29/66;H01L29/78;H01L21/00;H01L29/06 主分类号 H01L21/3205
代理机构 Haynes and Boone, LLP 代理人 Haynes and Boone, LLP
主权项 1. A method of fabricating a semiconductor device, comprising: forming a gate over a substrate, forming at least one through-hole opening in the gate; filling the at least one through-hole opening with a dielectric material.
地址 Hsin-Chu TW