| 发明名称 | MEMS device, electronic module, electronic apparatus, and mobile unit | ||
| 摘要 | A MEMS device includes: a base substrate; a first wiring disposed on the base substrate using a first structure; a second wiring disposed on the base substrate using the first structure and a second structure connected to the first structure; and a MEMS element connected with the first wiring and the second wiring and arranged on the base substrate, wherein the first wiring and the second wiring include a crossing portion where the first wiring and the second wiring cross each other, and at the crossing portion, the first structure of the first wiring and the second structure of the second wiring cross each other. | ||
| 申请公布号 | US9067777(B2) | 申请公布日期 | 2015.06.30 |
| 申请号 | US201313941892 | 申请日期 | 2013.07.15 |
| 申请人 | Seiko Epson Corporation | 发明人 | Furuhata Makoto;Tanaka Satoru |
| 分类号 | H01L29/84;B81B3/00;B81B7/00 | 主分类号 | H01L29/84 |
| 代理机构 | Harness, Dickey & Pierce, P.L.C. | 代理人 | Harness, Dickey & Pierce, P.L.C. |
| 主权项 | 1. A MEMS device comprising: a base substrate; a first wiring disposed on the base substrate using a first structure, wherein a groove portion is disposed on the base substrate, and the first structure is disposed in the groove portion; a second wiring disposed on the base substrate using the first structure and a second structure connected to the first structure; and a MEMS element connected with the first wiring and the second wiring and arranged on the base substrate, wherein the first wiring and the second wiring include a crossing portion where the first wiring and the second wiring cross each other, at the crossing portion, the first structure of the first wiring and the second structure of the second wiring cross each other, and the groove portion at the crossing portion is deeper than the groove portion at the other portions. | ||
| 地址 | JP | ||