发明名称 |
SEMICONDUCTOR PACKAGE MODULE |
摘要 |
<p>A semiconductor package module according to the present invention includes a substrate on which one or more connection terminals are formed, a first electronic component which is mounted on a first surface of the substrate, a second electronic component which is mounted on a second surface of the substrate, and a third electronic component on which a connection electrode to connect one or more connection terminals to an external terminal is formed.</p> |
申请公布号 |
KR20150072846(A) |
申请公布日期 |
2015.06.30 |
申请号 |
KR20130160451 |
申请日期 |
2013.12.20 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
RYU, JONG IN;JO, EUN JUNG;YOO, DO JAE |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|