Interposer package-on-package structure

摘要

An integrated circuit (IC) package includes an IC die having a first surface and a second surface opposite of the first surface. The IC package includes first contact members coupled to the second surface of the IC die. The IC package includes a bottom substrate having a first surface and a second surface opposite of the first surface, where the first surface of the bottom substrate is coupled to the second surface of the IC die via the first contact members. The IC package includes an interposer substrate coupled to the first surface of the IC die via an adhesive material, where the adhesive material is disposed on at least a surface of the interposer substrate. The IC package includes second contact members coupled along a periphery of the interposer substrate, where the interposer substrate is coupled to the first surface of the bottom substrate via the second contact members.

主权项

1. An integrated circuit (IC) package comprising:
an IC die having a first surface and a second surface opposite of the first surface, wherein the second surface of the IC die includes a first plurality of electrical contact members; a bottom substrate having a first surface and a second surface, the second surface of the bottom substrate being opposite of the first surface of the bottom substrate, wherein the first surface of the bottom substrate is coupled to the IC die via the first plurality of electrical contact members, wherein the second surface of the bottom substrate includes a second plurality of electrical contact members; and an interposer substrate coupled to the first surface of the IC die via an adhesive material, wherein the adhesive material is disposed at a plurality of locations on a surface of the interposer substrate and the first surface of the IC die, wherein the interposer substrate includes a third plurality of electrical contact members, wherein the interposer substrate is coupled to the first surface of the bottom substrate via the third plurality of electrical contact members.