发明名称 |
Liquid crystal module and liquid crystal display device including the same |
摘要 |
A liquid crystal module 15 includes a liquid crystal display panel 10;a rear frame member 44 located on a rear side of the liquid crystal display panel; and a wiring board 60 located on the rear side of the liquid crystal display panel. A part of the wiring board has an opening 65 running through the board and/or a notch 70 formed therein. An inspection patch 80A, 80B having a thickness equal to, or larger than, that of the wiring board is attached to the opening and/or the notch. A part of the wiring board around the inspection patch is secured to the rear frame member via a double-sided adhesive tape 55A, 55B. |
申请公布号 |
US9069199(B2) |
申请公布日期 |
2015.06.30 |
申请号 |
US201113877369 |
申请日期 |
2011.10.05 |
申请人 |
Sharp Kabushiki Kaisha |
发明人 |
Isobe Hiroaki |
分类号 |
G02F1/1333;G02F1/13;G02F1/1345;G02F1/1335 |
主分类号 |
G02F1/1333 |
代理机构 |
Keating & Bennett, LLP |
代理人 |
Keating & Bennett, LLP |
主权项 |
1. A method for inspecting a securing state of a wiring board to a rear side of a liquid crystal display panel, the method comprising:
preparing a liquid crystal module; wherein the liquid crystal module comprises: a liquid crystal display panel; a rear frame member located on a rear side of the liquid crystal display panel; and a wiring board located on the rear side of the liquid crystal display panel; wherein: a part of the wiring board has an opening running through the board or a notch formed therein; an inspection patch having a thickness equal to, or larger than, that of the wiring board is attached to the opening or the notch; and a part of the wiring board around the inspection patch is secured to the rear frame member via a double-sided adhesive tape; and in the prepared liquid crystal module, checking a level difference between a surface of the inspection patch attached to the opening or the notch and a surface of the part of the wiring board around the inspection patch, thereby inspecting whether or not the wiring board is secured to the rear frame member. |
地址 |
Osaka JP |