发明名称 Manufacturing method of functional film and functional film
摘要 A manufacturing method of functional film comprising the steps of: a first step of feeding a lengthy substrate with self-support including a first laminate film on a back side, forming an organic film on a front side of the substrate while transferring the substrate, providing a second laminate film on a surface of the organic film, and taking up the substrate into a film roll; anda second step of loading the film roll on a vacuum deposition apparatus, continuously feeding the substrate including the first laminate film and the second laminate film from the film roll, removing the second laminate film while transferring the substrate, forming an inorganic film over the organic film of the substrate, and taking up the substrate into a film roll.
申请公布号 US9067381(B2) 申请公布日期 2015.06.30
申请号 US201113030757 申请日期 2011.02.18
申请人 FUJIFILM CORPORATION 发明人 Iwase Eijirou
分类号 B32B9/04;B32B27/08;B32B27/32;B32B27/36;C23C14/08;C23C14/56;C23C16/54;B05D7/04 主分类号 B32B9/04
代理机构 Young & Thompson 代理人 Young & Thompson
主权项 1. A manufacturing method of functional film comprising the steps of: a first step of feeding a lengthy substrate with self-support including a removable first laminate film on a back side, forming an organic film on a front side of the substrate while transferring the substrate, providing a second laminate film on a surface of the organic film under atmospheric pressure, and taking up the substrate into a film roll; a second step of loading the film roll on a vacuum deposition apparatus, continuously feeding the substrate including the first laminate film and the second laminate film from the film roll, removing the second laminate film while transferring the substrate, forming an inorganic film over the organic film of the substrate, and taking up the substrate into a film roll; and a step of feeding the substrate from the film roll and attaching the second laminate film to a top layer of a functional layer including the organic film and the inorganic film, wherein adhesion between the second laminate film and the top layer is less than adhesion between the first laminate film and the substrate.
地址 Tokyo JP