主权项 |
1. A semiconductor device, comprising:
a booster circuit for supplying peripheral circuits of a memory cell array with an output voltage higher than an input voltage, the booster circuit comprising one or more booster units, each booster unit connected to a plurality of transistors, each transistor connected to a booster circuit output terminal; the booster unit comprising:
a first set of capacitors, a first member of the first set of capacitors having a first end supplied with a supply voltage and a second end supplied with a first clock signal;a first set of transistors including first and second transistors, the gate and drain of each first set transistor electrically connected to the first end of a corresponding member of the first set of capacitors, with each transistor of the first set connected in series as diodes, with the drain and gate of a first member of the first set of transistors connected to the supply voltage, and the source of a last member of the first set of transistors connected to a booster unit output terminal;a second set of capacitors, a first member of the second set of capacitors having a first end supplied with the supply voltage and a second end supplied with a second clock signal, the second clock signal complementary to the first clock signal;a second set of transistors including third and fourth transistors, the gate and drain of each second set transistor electrically connected to the first end of a corresponding member of the second set of capacitors, with each transistor of the second set connected in series as diodes, with the drain and gate of a first member of the second set of transistors connected to the supply voltage, and the source of a last member of the second set of transistors connected to the booster unit output terminal;each of the first and second sets of capacitors of the booster unit formed in a layer stacked configuration, wherein a plurality of conductive layers are stacked with insulating layers in a stair-stepped configuration above a substrate, such that at least one end of each conductive layer is not overlapped by the conductive layer directly above, and includes first and second conductive layers that are each a first distance away from the substrate, the first conductive layer electrically connected to a gate of the first transistor and the second conductive layer electrically connected to a gate of the second transistor, and third and fourth conductive layers that are each a second distance, greater than the first distance, away from the substrate, the third conductive layer electrically connected to a gate of the third transistor and the fourth conductive layer electrically connected to a gate of the fourth transistor. |