| 发明名称 | Three-dimensional structure in which wiring is provided on its surface | ||
| 摘要 | One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring. | ||
| 申请公布号 | US9070393(B2) | 申请公布日期 | 2015.06.30 |
| 申请号 | US201414196363 | 申请日期 | 2014.03.04 |
| 申请人 | PANASONIC CORPORATION | 发明人 | Yoshioka Shingo;Fujiwara Hiroaki;Takashita Hiromitsu;Takeda Tsuyoshi |
| 分类号 | H01L23/04;G11B5/48;H01L23/00;H01L25/065;H01L25/00;H05K1/11;H05K1/18;H05K3/18;H01L23/498;H01L21/48;H01L21/66;H01L23/31;H01L21/56;H01L23/14 | 主分类号 | H01L23/04 |
| 代理机构 | Greenblum & Bernstein, P.L.C. | 代理人 | Greenblum & Bernstein, P.L.C. |
| 主权项 | 1. A three-dimensional structure in which a wiring is provided on a surface, comprising: an insulating resin layer that contains a filler comprising at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed wiring gutter is provided in a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed wiring gutter, wherein an average particle size of the filler is equal to or less than 1/2 of a width of the recessed wiring gutter and is 0.01 μm to 10 μm. | ||
| 地址 | Osaka JP | ||