CMP pad dressers with hybridized abrasive surface and related methods

摘要

A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.

主权项

1. A CMP pad conditioner, comprising:
a plurality of particle abrasive segments, each particle abrasive segment including:
a particle segment blank; andan abrasive layer attached to the particle segment blank, the abrasive layer including a plurality of superabrasive particles each having a working end with a tip that aligns along a designated profile and varies from the profile by about 1 micron to about 150 microns; and a pad conditioner substrate; each of the particle abrasive segments being permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layers as the pad conditioner and the CMP pad are moved relative to one another.