发明名称 Composition for metal plating comprising suppressing agent for void free submicron feature filling
摘要 <p>Composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising at least three active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides.</p>
申请公布号 IL215157(A) 申请公布日期 2015.06.30
申请号 IL20110215157 申请日期 2011.09.15
申请人 BASF SE 发明人
分类号 C25D 主分类号 C25D
代理机构 代理人
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