Semiconductor device, method of forming semiconductor device, and data processing system

摘要

A semiconductor device includes the following elements. A semiconductor substrate includes an isolation region. The semiconductor substrate has a groove in the isolation region. A pad electrode is disposed in the groove. A pad contact plug is disposed in the groove. The pad contact plug is disposed on the pad electrode. A gate contact plug is disposed on the pad contact plug. The gate contact plug is electrically coupled through the pad contact plug to the pad electrode. An insulating side wall is disposed in the groove. The insulating side wall covers side surfaces of the pad contact plug and a lower portion of the gate contact plug, and the insulating side wall covers a part of an upper surface of the pad electrode.

主权项

1. A semiconductor device comprising:
a semiconductor substrate comprising an isolation region, the semiconductor substrate having a groove in the isolation region; a pad electrode in the groove; a pad contact plug in the groove, the pad contact plug being disposed on the pad electrode; a gate contact plug disposed on the pad contact plug, the gate contact plug being electrically coupled through the pad contact plug to the pad electrode; and an insulating side wall in the groove, the insulating side wall covering side surfaces of the pad contact plug and a lower portion of the gate contact plug, and the insulating side wall covering a part of an upper surface of the pad electrode.