| 摘要 |
A surface of a wafer is protected during a laser process and can be washed through water after the process, so that adhesion such as debris is not shown on the surface of the wafer. Poly-N-vinylacetamide is used as a water-soluble adhesive for covering and protecting surfaces (4 and 14) of a wafer (1) during a laser process. A solution thereof is used as a protective film material for a laser process and is washed out by a washing rinse liquid after the process. Adhesion of debris (15) on the surfaces (4 and 14) of the wafer can be certainly prevented by means of the protective film material. Moreover, the protective film material for a laser process may further include an absorbent for absorbing processing laser light. |
