| 摘要 |
<p>A power semiconductor package according to one embodiment of the present invention includes a first package which includes a substrate where a first device is mounted, a molding part which surrounds the first device and the substrate and includes a cavity to expose a part of the substrate, and a lead frame whose one end is bonded to the substrate and the other end protrudes to the outside of the molding part, and a second package which includes a buried lead frame where a second device is mounted, a molding part which surrounds the second device and the buried lead frame, and a protrusive lead frame whose one end is separated from the buried lead frame and the other end protrudes to the outside of the molding part. The second package is inserted into the cavity of the first package.</p> |
