LED PACKAGE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to an LED package for increasing light-emitting efficiency and a method for manufacturing the same. The LED package for increasing light-emitting efficiency according to the present invention includes: a substrate; an LED chip mounted on the upper end of the substrate; a reflection part which is prepared on the upper end of the substrate to a point which is separated from the lateral part of the LED chip by a predetermined distance, to reflect light emitted from the lateral side of the LED chip; and a sealing material which is formed in the outer side of the reflection part and the LED chip.