FLEXIBLE CUPPER CLAD LAMINATED FILM FOR SEMI-ADDITIVE AND MANUFACTURING METHOD THE SAME

摘要

The present invention relates to a flexible single-sided semi-additive copper clad laminate, and a manufacturing method thereof. The manufacturing method for a flexible single-sided semi-additive copper clad laminate comprises: a step of cleaning and reducing a roughness of a surface of a polyimide (PI) film through plasma treatment; a step of depositing copper onto a Ni-Cr tie-layer acting as a conducting layer, and a seed layer using a sputtering method, which is a physical vapor deposition (PVD) after plasma treatment; and a step of coating the Cu layer on a copper sulfate solution using the electroplating method. According to the manufacturing method, the plating current density (unit: ASD) is converted to either 2.0 A/dm²or 3.0 A/dm²while concentration of a plating solution and an additive is maintained to electroplate copper. The flexible single-sided semi-additive copper clad laminate and the manufacturing method thereof uses the sputtering method, which is PVD to form a conductive seed layer on the surface of a non-conductive PI film, and increases a flexibility of copper through variations in the plating current density during the electroplating process to avoid defects and damage to a pattern; and forms an ultra-fine circuit of a flexible copper clad laminate for semi-additive of an ultra-fine pattern, whereby as a result solves a conventional problem resulting from a reduction in thickness of copper plating.