发明名称 |
CURABLE RESIN COMPOSITION, PRODUCTION METHOD OF IMAGE SENSOR CHIP USING THE SAME, AND IMAGE SENSOR CHIP |
摘要 |
To provide a curable resin composition capable of producing an image sensor chip in which the color shading is suppressed, a production method of image sensor chip using the same, and an image sensor chip. A curable resin composition which is capable of being coated on a solid-state imaging device substrate and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, a production method of image sensor chip using the same, and an image sensor chip. |
申请公布号 |
SG11201504182R(A) |
申请公布日期 |
2015.06.29 |
申请号 |
SG11201504182R |
申请日期 |
2013.11.27 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
EZOE TOSHIHIDE;SHIMADA KAZUTO |
分类号 |
G02B5/22;C08L101/00;C09D7/12;C09D201/00;H01L27/14;H04N5/225;H04N5/335 |
主分类号 |
G02B5/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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