发明名称 CURABLE RESIN COMPOSITION, PRODUCTION METHOD OF IMAGE SENSOR CHIP USING THE SAME, AND IMAGE SENSOR CHIP
摘要 To provide a curable resin composition capable of producing an image sensor chip in which the color shading is suppressed, a production method of image sensor chip using the same, and an image sensor chip. A curable resin composition which is capable of being coated on a solid-state imaging device substrate and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, a production method of image sensor chip using the same, and an image sensor chip.
申请公布号 SG11201504182R(A) 申请公布日期 2015.06.29
申请号 SG11201504182R 申请日期 2013.11.27
申请人 FUJIFILM CORPORATION 发明人 EZOE TOSHIHIDE;SHIMADA KAZUTO
分类号 G02B5/22;C08L101/00;C09D7/12;C09D201/00;H01L27/14;H04N5/225;H04N5/335 主分类号 G02B5/22
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