| 摘要 |
FIELD: metallurgy.SUBSTANCE: invention relates to device for gas bubbling of electrolyte bath in metal electrolytic winning plant. This device allows gas feed onto cathode surface and comprises the system of gas pipes, means for gas feed to said system and gas amount control means. Note here that walls of gas pipes are provided with gas feed orifices partially preventing gas leaks there through and feeding gas bubbles directly upward from gas feed orifices with gas bubbles distribution from cathode bottom edge and their uniform lift from cathode both sides. Invention discloses also the plant and process for metal (copper) electrolytic winning and application of said plant.EFFECT: ruled out large gas bubbles at electrolyte bath bubbling.17 cl, 4 dwg |
