IMAGE SENSOR DEVICES, METHODS OF MANUFACTURE THEREOF, AND SEMICONDUCTOR DEVICE MANUFACTURING METHODS

摘要

Image sensor devices, methods of manufacture thereof, and semiconductor device manufacturing methods are disclosed. In some embodiments, a method of manufacturing a semiconductor device includes the step of bonding a first semiconductor wafer to a second semiconductor wafer, the first semiconductor wafer comprising a substrate and a wiring structure coupled to the substrate. The method includes the step of removing a portion of the substrate from the first semiconductor wafer to expose a portion of the wiring structure.