LOW WARPAGE WAFER BONDING THROUGH USE OF SLOTTED SUBSTRATES

摘要

In a wafer bonding process one or both of two wafer substrates are scored prior to bonding. By creating slots in the substrate the wafer s characteristics during bonding are similar to that of a thinner wafer thereby reducing potential warpage due to differences in CTE characteristics associated with each of the wafers. Preferably the slots are created consistent with the singulation/dicing pattern so that the slots will not be present in the singulated packages thereby retaining the structural characteristics of the full thickness substrates.