POLISHING DEVICE HAVING FIXING STRUCTURE BETWEEN HEAD AND WAFER SUPPORTER

摘要

The present invention relates to a polishing device having a fixing structure between a head and a wafer supporter. The polishing device includes the head connected to a rotation shaft located on an upper side; and the wafer supporter which is detachably fixed to the lower side of the head and allows a wafer as a polishing object to be attached to a lower part. The head and the wafer support are mechanically fixed to prevent a change in a relative position in a polishing process. The lower side of the wafer is polished by the rotation of the rotation shaft. According to the polishing device, torque applied to the rotation shaft can be transmitted to the wafer support via the head without loss, by using the fixing structure between the head and the wafer supporter. The desired rotation speed of the wafer supporter can be kept and controlled. Quantitative recipe can be implemented. Therefore, the uniformity of product quality can be achieved.