| 摘要 |
A semiconductor integrated circuit device in the present invention has improved performance. A semiconductor device (1) includes a surrounding circuit chip (3) and a logic chip (4) installed on a wiring substrate (2). A wiring member (2) and a surrounding circuit chip (3) are electrically connected, and the surrounding circuit chip (3) and the logic chip (4) are electrically connected. The surrounding circuit chip (3) includes a first surrounding circuit, a power control circuit, a temperature sensor, and a first RAM, and the logic chip (4) comprises a CPU, a second surrounding circuit, and a second RAM. The first surrounding circuit and the first RAM are manufactured based on a first process rule, and the CPU, the second surrounding circuit, wherein the second RAM is manufactured based on a second process rule more detail than the first process rule. |
