| 摘要 |
<p>The present invention relates to a chip electronic component and a manufacturing method thereof, and more specifically, to a chip electronic component which can implement an inner coil structure with a high aspect ratio (AR) by preventing short between coils and increasing the height in comparison with the width of the coil, and to a manufacturing method thereof. The chip electronic component comprises: a magnetic body including an insulation substrate; an inner coil unit formed on at least one surface of the insulation substrate; and an external electrode formed on one cross section of the magnetic body and connected with the inner coil unit.</p> |
